首页> 外国专利> HEAT TREATMENT METHOD FOR GROUP II-VI COMPOUND SEMICONDUCTOR SUBSTRATE AND THE SEMICONDUCTOR SUBSTRATE

HEAT TREATMENT METHOD FOR GROUP II-VI COMPOUND SEMICONDUCTOR SUBSTRATE AND THE SEMICONDUCTOR SUBSTRATE

机译:II-VI族化合物半导体基体和半导体基体的热处理方法

摘要

PROBLEM TO BE SOLVED: To provide a heat treatment method for a group II-VI compound semiconductor substrate capable of realizing making the resistance of the substrate low without deteriorating the crystalinity, and to provide the group II-VI compound semiconductor substrate subjected to heat treatment.;SOLUTION: The heat treatment method of the group II-VI compound semiconductor substrate includes the steps of preparing a ZnSe substrate 10 having a front side 10a on which a semiconductor film serving as an active layer is formed, and a rear side 10b in contact with an aluminum film 9 and located opposite to the front side 10a; and applying heat treatment to the ZnSe substrate 10 in a processing chamber exposed in an atmosphere comprising Zn of a group II element configuring the ZnSe substrate 10.;COPYRIGHT: (C)2005,JPO&NCIPI
机译:解决的问题:提供一种II-VI族化合物半导体衬底的热处理方法,该热处理方法能够实现降低衬底的电阻而不会降低结晶度,并且提供经过热处理的II-VI族化合物半导体衬底。解决方案:II-VI族化合物半导体衬底的热处理方法包括以下步骤:制备ZnSe衬底10,该ZnSe衬底10具有在其上形成有用作有源层的半导体膜的前侧10a以及在其内的后侧10b。与铝膜9接触并与前侧10a相对。在暴露于包含构成ZnSe衬底10的II族元素的Zn的气氛中的处理室内对ZnSe衬底10进行热处理; COPYRIGHT:(C)2005,JPO&NCIPI

著录项

  • 公开/公告号JP2005217153A

    专利类型

  • 公开/公告日2005-08-11

    原文格式PDF

  • 申请/专利权人 SUMITOMO ELECTRIC IND LTD;

    申请/专利号JP20040021481

  • 发明设计人 NAMIKAWA YASUO;

    申请日2004-01-29

  • 分类号H01L21/22;

  • 国家 JP

  • 入库时间 2022-08-21 22:36:52

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