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MAGNETORESISTANCE EFFECT ELEMENT, THIN FILM MAGNETIC HEAD, THIN FILM MAGNETIC HEAD WAFER, HEAD GIMBAL ASSEMBLY, HEAD ARM ASSEMBLY, HEAD STACK ASSEMBLY, AND HARD DISK DEVICE
MAGNETORESISTANCE EFFECT ELEMENT, THIN FILM MAGNETIC HEAD, THIN FILM MAGNETIC HEAD WAFER, HEAD GIMBAL ASSEMBLY, HEAD ARM ASSEMBLY, HEAD STACK ASSEMBLY, AND HARD DISK DEVICE
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机译:磁阻效应元件,薄膜磁头,薄膜磁头晶片,头金银花组件,头臂组件,头堆叠组件和硬磁盘设备
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摘要
PROBLEM TO BE SOLVED: To control magnetization of a synthetic pinned layer in a CPP type magnetoresistance effect element having a synthetic pinned layer, and to enable it to obtain a large magnetoresistance change.;SOLUTION: The magnetoresistance effect element 2 includes: a first ferromagnetic layer 7 wherein the magnetizing direction is fixed to the external magnetic field: a first nonmagnetic intermediate layer 8; a first magnetic layer where a second ferromagnetic layer 9 whose magnetizing direction is fixed in the opposite direction to the first ferromagnetic layer 7 is laminated in this order; a second nonmagnetic intermediate layer 10; and a laminating part wherein a second magnetic layer 11 in which a magnetizing direction changes to the external magnetic field is laminated in this order. A sense current flows through a laminating part nearly in the laminating direction. The ratio between the film thickness of the first ferromagnetic layer 7 and the film thickness of the second ferromagnetic layer 9 is 1.4 and 1.9. The ratio between the product of the saturation magnetization of the first ferromagnetic layer 7 and the film thickness and the product of the saturation magnetization of the second ferromagnetic layer 9 and the film thickness is 0.9 and 1.1.;COPYRIGHT: (C)2005,JPO&NCIPI
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