首页> 外国专利> MULTILAYER SUBSTRATE, FEEDBACK CURRENT ROUTE DESIGN DEVICE THEREFOR, FEEDBACK CURRENT ROUTE DESIGN METHOD THEREFOR, PROGRAM FOR IMPLEMENTING THE METHOD AND RECORDING MEDIUM HAVING THE PROGRAM RECORDED THEREON

MULTILAYER SUBSTRATE, FEEDBACK CURRENT ROUTE DESIGN DEVICE THEREFOR, FEEDBACK CURRENT ROUTE DESIGN METHOD THEREFOR, PROGRAM FOR IMPLEMENTING THE METHOD AND RECORDING MEDIUM HAVING THE PROGRAM RECORDED THEREON

机译:多层基板,作为当前方法的反馈电流路由设计设备,作为当前方法的反馈方法,用于实现该方法并记录具有所记录程序的介质的程序

摘要

PROBLEM TO BE SOLVED: To dissolve the parting and bypassing of a feedback current route even when a wiring pattern is made high in density and complicated.;SOLUTION: In the case that a part Pw of the wiring pattern Pa1 of a wiring layer L2 is overlapped with a non-conductive part between the respective conductive part patterns Pb1 and Pb2 of a plane layer L2 and the feedback current route of the plane layer L1 is parted, the conductive bridge 21 of the wiring layer L2 connected to the respective conductive part patterns Pb1 and Pb2 of the plane layer L1 through respective through-holes 23 on both sides of the part Pw over the part Pw along the wiring pattern Pa1 at the part Pw is designed.;COPYRIGHT: (C)2005,JPO&NCIPI
机译:解决的问题:即使在使布线图案的密度高且复杂的情况下,也要解决反馈电流路径的分离和旁路的问题。解决方案:在布线层L2的布线图案Pa1的一部分Pw为在平面层L2的各个导电部分图案Pb1和Pb2之间与非导电部分重叠并且平面层L1的反馈电流路径被分开,布线层L2的导电桥21连接到各个导电部分图案设计平面层L1的Pb1和Pb2穿过部分Pw上方的部分Pw两侧的相应通孔23,沿着部分Pw处的布线图案Pa1。版权所有:(C)2005,JPO&NCIPI

著录项

  • 公开/公告号JP2004319776A

    专利类型

  • 公开/公告日2004-11-11

    原文格式PDF

  • 申请/专利权人 SHARP CORP;

    申请/专利号JP20030111860

  • 发明设计人 MATSUO HISAAKI;

    申请日2003-04-16

  • 分类号H05K3/46;G06F17/50;

  • 国家 JP

  • 入库时间 2022-08-21 22:35:40

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