首页> 外国专利> ON-THE-SPOT MEASURING UNIT FOR LASER BEAM MACHINING, ON-THE SPOT MEASURING METHOD, AND LASER BEAM MACHINING APPARATUS

ON-THE-SPOT MEASURING UNIT FOR LASER BEAM MACHINING, ON-THE SPOT MEASURING METHOD, AND LASER BEAM MACHINING APPARATUS

机译:激光束加工的现场测量装置,现场测量方法和激光束加工设备

摘要

PPROBLEM TO BE SOLVED: To provide an on-the-spot measuring unit for laser beam machining capable of collecting more detailed and accurate information in the middle of laser beam machining, as well as two-dimensional strength information of a reaction field or a surface shape of a workpiece in the middle of laser beam machining, and also to provide an on-the-spot measuring method and a laser beam machining apparatus to which these unit and method are applied. PSOLUTION: In the laser beam machining apparatus which performs machining by irradiating a workpiece surface with a machining laser beam, there is provided a means for acquiring reaction field information, a means by which three-dimensional information or three- and two-dimensional information is obtained pertaining to the reaction field near the machining point on the workpiece surface when it is irradiated with the machining laser beam. PCOPYRIGHT: (C)2005,JPO&NCIPI
机译:

要解决的问题:提供一种用于激光束加工的现场测量单元,该单元可以在激光束加工过程中收集更详细,准确的信息以及反应场的二维强度信息还提供一种现场测量方法以及应用了这些单元和方法的激光束加工设备,该激光束加工过程中的工件的表面形状或工件的表面形状。

解决方案:在通过用加工激光束照射工件表面进行加工的激光束加工设备中,提供了一种用于获取反应场信息的装置,该装置用于获得三维信息或三,二维信息。在被加工激光束照射时,获得与工件表面上的加工点附近的反应场有关的尺寸信息。

版权:(C)2005,JPO&NCIPI

著录项

  • 公开/公告号JP2005262220A

    专利类型

  • 公开/公告日2005-09-29

    原文格式PDF

  • 申请/专利权人 RICOH CO LTD;

    申请/专利号JP20040073911

  • 发明设计人 MORITA NOBUHIRO;YAMADA YASUSHI;SEO MANABU;

    申请日2004-03-16

  • 分类号B23K26/02;B23K26/00;B23K26/06;

  • 国家 JP

  • 入库时间 2022-08-21 22:34:45

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