METHOD FOR FREE-FORM CUTTING BENT SUBSTRATE MADE OF BRITTLE MATERIAL

摘要

PPROBLEM TO BE SOLVED: To provide a method of surely and easily cutting off a bent substrate from a brittle material. PSOLUTION: The method of cutting off the bent substrate from the brittle material includes following processes: a process for arranging the curved substrate on a supporting body; a process for directing laser beam having orientation vertical to the supporting body toward a separation line; a process for moving the laser beam accompanied by a following cooling spot along the separation line with 2 steps composed of a 1st step for adjusting process parameters such as the laser output, a laser beam profile, the focus position of the laser beam profile, the proceeding rate, and cooling to notch the substrate up to a prescribed depth along the separation line and a 2nd step for properly increasing mechanical stress corresponding to the parameters to make the notch formed in the 1st process more deep to completely separate the substrate off; and a process for removing the separated processing member. PCOPYRIGHT: (C)2005,JPO&NCIPI