ELECTRONIC COMPONENT PACKAGING APPARATUS, NOZZLE CONFORMITY DECIDING METHOD AND NOZZLE DATA CREATING METHOD FOR ELECTRONIC COMPONENT PACKAGING APPARATUS

摘要

PROBLEM TO BE SOLVED: To provide an electronic component packaging apparatus, a nozzle conformity judging method and a nozzle data creating method in the electronic component packaging apparatus which can ensure conformity of a suction nozzle with an electronic component to prevent packaging errors.;SOLUTION: In the electronic component packaging apparatus in which a suction nozzle, mounted replaceably on a transfer head holds an electronic component to package it on a substrate, a mounting mechanism makes the transfer head suck and hold the electronic component by the suction nozzle perform a predetermined simulated mounting operation for deciding conformity, and a result of a first time recognition of the part before the predetermined operation is compared with the result of a second time recognition of parts after the operation, thereby deciding the conformity of the suction nozzle with the electronic component to create nozzle data, on the basis of the result of the decision. In this way, the conformity of the suction nozzle with the electronic component and the packaging errors can be prevented.;COPYRIGHT: (C)2005,JPO&NCIPI