DOUBLE-SIDED POLISHING METHOD FOR SUBSTRATE, GUIDE RING FOR DOUBLE-SIDED POLISHING, AND DOUBLE-SIDED POLISHING DEVICE FOR SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To provide a double-sided polishing method, a guide ring for double-sided polishing, and a double-sided polishing device for providing high flatness.;SOLUTION: In the polishing method, the substrate W is held to the guide ring 1, and the guide ring 1 is moved between an upper polishing plate 2 and a lower polishing plate 4 with abrasive cloth 3, 5 stuck thereto, to simultaneously polish the front and rear faces of the substrate W while applying polishing load to the substrate W by the abrasive cloth 3, 5 of the upper and lower polishing plates 2, 4. In this method, at least the abrasive cloth 5 of the lower polishing plate 4 is pressed by the guide ring 1, and the pressing load to the abrasive cloth of the lower polishing plate 4 from the guide ring 1 is made 0.5-3 times of the polishing load to the substrate W from the abrasive cloth 5 of the lower polishing plate 4 to perform polishing. The guide ring for double-sided polishing is provided with a pressing means 12 for applying pressure to the lower polishing plate 4 or the upper and lower polishing plates 2, 4 from the front and rear faces of the guide ring 1. In the double-sided polishing device for the substrate, the guide ring 1 presses the abrasive cloth of the surface table, and the pressing load of the guide ring 1 is 0.5-3 times of the polishing load between the substrate W and the abrasive cloth 3, 4.;COPYRIGHT: (C)2005,JPO&NCIPI