METHOD FOR EVALUATING SURFACE STATE OF WAFER, METHOD FOR MANAGING WAFER MANUFACTURING STEPS, AND METHOD FOR MANUFACTURING WAFER

摘要

PROBLEM TO BE SOLVED: To provide a method for enabling suitable evaluation of the state of the back surface of a wafer to provide an excellent mounting/dismounting characteristic to/from an electrostatic chuck and to supply the wafer allowing suppression of variations in dry etching quality, to provide a method for managing wafer manufacturing steps based on the evaluating method, and to provide a method for manufacturing the wafer having the predetermined state of a back surface of the wafer.;SOLUTION: A film for etching rate evaluation is formed on one main surface of a wafer, the film for etching grate evaluation is dry etched, the other main surface of the wafer is evaluated according to the etching rate of the etching rate evaluating film.;COPYRIGHT: (C)2005,JPO&NCIPI