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METHOD AND DEVICE FOR PRESS-FITTING SUBSTRATE AND JOINED SUBSTRATE PRODUCED WITH PRESS-FITTING

机译:压配合基体的方法和装置以及用压配合产生的接合基体

摘要

PPROBLEM TO BE SOLVED: To improve a production yield of a joined substrate, to heighten alignment accuracy between upper and lower substrates and besides to more certainly prevent seal path from occurring in pressing by dividing a large size substrate. PSOLUTION: In a method for press-fitting the substrates, a sheet of the lower substrate 1 is placed on a lower press plate 10 which is disposed on a surface plate 12. A sheet out of bisected parts of the upper substrate 2 is transferred to the upper side of the lower substrate 1 with a suction plate 33 of a second robot hand 31, is aligned with an optical system 34 for alignment and is superposed on the lower substrate 1. The upper substrate 2 is joined by sending down an upper press plate 11 and by being pressurized under heating. Subsequently the lower substrate 1 is transferred by one pitch, the other sheet of the upper substrate 2 is aligned toward the lower substrate 1 and is superposed thereon and the joined substrate 4 is obtained by heating and pressurizing the upper substrate 2 with the upper press plate 11. PCOPYRIGHT: (C)2005,JPO&NCIPI
机译:

要解决的问题:为了提高接合基板的生产率,提高上下基板之间的对准精度,并且更确定地防止通过分割大尺寸基板而在密封中发生密封路径。

解决方案:在压装基板的方法中,将下基板1的薄片放置在下压板10上,该下压板10设置在面板12上。上基板2的等分部分中的薄片。用第二机械手31的吸板33将其转移到下基板1的上侧,与用于对准的光学系统34对准,并叠置在下基板1上。通过向下传送来接合上基板2上压板11并在加热下被加压。随后,将下基板1以一个间距传送,将上基板2的另一片对准下基板1并叠置在其上,并通过用上压板加热和加压上基板2来获得接合的基板4。 11.

版权:(C)2005,JPO&NCIPI

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