CHEMICAL MECHANICAL POLISHING DEVICE AND WAFER

摘要

PROBLEM TO BE SOLVED: To provide a chemical mechanical polishing device, capable of maintaining stabilized power supplying condition to a wafer in the electrolytic polishing of the wafer having a metal film or the like, and to provide the wafer which copes with the device.;SOLUTION: The chemical mechanical polishing device pushes the wafer W with a conductive film formed on the surface thereof against a polishing pad 20, while supplying slurry, and impresses a voltage between the wafer and the polishing pad to flatten the surface, while applying electrolytic operation. An electrode 15 for supplying power to the wafer W is constituted of a base unit 15A, consisting of a member having rubber hardness of less than 90 in the rubber hardness as stipulated by JIS K6253, and a conductive layer 15B provided on the surface of the base unit and having an electric resistance of less than 100 Ω.;COPYRIGHT: (C)2006,JPO&NCIPI