CAM DATA PREPARING METHOD FOR ELECTRONIC CIRCUIT BOARD, CAD/CAM SYSTEM FOR ELECTRONIC CIRCUIT BOARD, COMPUTER PROGRAM USED THEREFOR, AND MANUFACTURING METHOD FOR ELECTRONIC CIRCUIT BOARD

摘要

PROBLEM TO BE SOLVED: To provide a CAM data preparing method for an electronic circuit board capable of converting properly and efficiently a CAD data of a board element reflected with an outside diameter dimension of a soldering bump to be obtained into a CAM data comprising an aperture part inside diameter of a solder paste applying mask used for forming the bump.;SOLUTION: The outside diameter d' of a bump-related design element such as a solder land is used as the CAD data, it is converted into the aperture part inside diameter d₀ of the solder paste applying mask as the CAM data. The aperture part inside diameter d₀ is corrected to make a ratio =d₀/d' value of the aperture part inside diameter d₀ to the outside diameter d' of the bump-related design element get large in accompaniment to reduction of the outside diameter d' of the bump-related design element.;COPYRIGHT: (C)2005,JPO&NCIPI