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TRANSFERRING METHOD, PEELING METHOD, AND PEELING DEVICE

机译:转移方法,成皮方法和成皮设备

摘要

PROBLEM TO BE SOLVED: To reduce the electrostatic breakdown of elements in a transferring method in which the elements are transferred to a transferred substrate by peeling the elements from an original substrate.;SOLUTION: The transferring method in which the elements 306 formed on the original substrate 300 are transferred to the transferred substrate 308 includes a laminating step of laminating the substrates 300 and 308 to each other by laminating the elements 306 to the substrate 308, an injecting step of injecting an ionized fluid into the interfaces between the elements 306 and substrate 300, and a transferring step of transferring the elements 306 to the substrate 308 by peeling the substrate 300 from the elements 306 at the interfaces into which the ionized fluid is injected.;COPYRIGHT: (C)2005,JPO&NCIPI
机译:解决的问题:在转移方法中减少元素的静电击穿,在转移方法中,通过从原始衬底上剥离元素,将元素转移到转移的衬底上;解决方案:转移方法,其中在原始衬底上形成元素306将衬底300转移到转移的衬底308包括通过将元件306层压到衬底308来将衬底300和308彼此层压的层压步骤,将电离流体注入到元件306和衬底之间的界面中的注入步骤。 300;以及通过将衬底300从注入离子化流体的界面处的元件306剥离而将元件306转移到衬底308的转移步骤。版权所有:(C)2005,JPO&NCIPI

著录项

  • 公开/公告号JP2005079553A

    专利类型

  • 公开/公告日2005-03-24

    原文格式PDF

  • 申请/专利权人 SEIKO EPSON CORP;

    申请/专利号JP20030311917

  • 发明设计人 UTSUNOMIYA SUMIO;

    申请日2003-09-03

  • 分类号H01L27/12;H01L21/02;H01L21/336;H01L29/786;

  • 国家 JP

  • 入库时间 2022-08-21 22:31:48

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