RELAY MEMBER AND MULTICHIP PACKAGE USING RELAY MEMBER

摘要

PPROBLEM TO BE SOLVED: To provide a relay member and a multichip package capable of keeping a wire length short to ensure high yield in the multichip package for mounting a center pad type semiconductor chip. PSOLUTION: A second semiconductor chip and a relay member are mounted on a first semiconductor chip on the surface of which a plurality of first pads are formed. A resin sealing structure is provided for sealing the first semiconductor chip, the second semiconductor chip, and the relay chip. The second semiconductor chip includes a plurality of second pads disposed at the center. The relay member includes a first relay pad, a second relay pad, and a coupling part for interconnecting the first relay pad and the second relay pad. Electric connection of the second semiconductor chip from the second pad includes a case connected to a connection terminal and a case connected to the connection terminal or the first semiconductor chip from the second relay pad via the first relay pad. PCOPYRIGHT: (C)2005,JPO&NCIPI