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Batch-Fabricated High-Power RF Microrelays With Direct On-PCB Packages

机译：采用直接pCB封装的批量制造高功率RF微光栅

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Fatih M. Ozkeskin; Sangjo Choi; Student Member; Kamal Sarab; Yogesh B. Gianch;
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1. Batch-Fabricated High-Power RF Microrelays With Direct On-PCB Packages [J] . Ozkeskin F. M., Choi S., Sarabandi K., Microelectromechanical Systems, Journal of . 2012,第4期

机译：具有直接PCB封装的批量制造的高功率RF微继电器
2. 10-Gb/s transmission using 1.3-/spl mu/m low-chirp high-power directly modulated, packaged DFB laser module for short distance (>50 km) applications [J] . Kim I., Miller T.J. IEEE Photonics Technology Letters . 1997,第8期

机译：采用1.3- / splμ/ m低-高功率直接调制，封装的DFB激光模块的10 Gb / s传输，适用于短距离（> 50 km）应用
3. Reduction of Die-Bonding Interface Thermal Resistance for High-Power LEDs Through Embedding Packaging Structure [J] . Xiang Lei, Huai Zheng, Xing Guo, IEEE Transactions on Power Electronics . 2017,第7期

机译：通过嵌入封装结构降低大功率LED的芯片键合界面热阻
4. Demonstration of On-PCB Optical Interconnection Using Surface-Mount Package and Polymer Waveguide [C] . Yuzo Ishii, Tsuyoshi, Hayashi, Electronic Components Technology Conference . 2003

机译：使用表面贴装封装和聚合物波导的PCB光学互连的演示
5. A Study of Direct Digital Manufactured RF/Microwave Packaging [D] . Stratton, John W.I. 2015

机译：直接数字制造的射频/微波包装的研究
6. Batch-fabricated high-performance graphene Hall elements [O] . Huilong Xu, Zhiyong Zhang, Runbo Shi, -1

机译：批量制造的高性能石墨烯霍尔元件
7. Implementation of the EC directive on packaging and packaging waste and implications for the environmental performance and competitiveness of firms along the food industry supply chain [O] . Hitchens David 1999

机译：执行关于包装和包装废弃物的EC指令以及对食品工业的环境绩效和竞争力的影响
8. Performance of a Directly Water-Cooled Silicon Crystal for Use in High-Power Synchrotron Radiation Applications. [R] . Oversluizen, T., Stefan, P. M., Sharma, S., 1989

机译：用于高功率同步辐射应用的直接水冷硅晶体的性能。

Batch-Fabricated High-Power RF Microrelays With Direct On-PCB Packages

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