The device and method in order to control the influence of the electrolytic etching in the leaf type wafer washing system

摘要

Topic Solutions Method and the device in order to control the influence of the electrolytic etching in the leaf type wafer washing system are offered. With one execution form, method in order to hold down influence of the electrolytic etching in the leaf type wafer washing system to minimum is offered. Method starts in the process which supplies the cleaner which includes the corrosion inhibiter to the surface of the wafer. Next, the surface of the wafer, fixed period, is exposed to the cleaner. Next, the gray level gradient in the boundary of the cleaner and the surface of the wafer is recovered. Next, in order to remove the cleaner, are supplied simultaneously with the rinse medicine and the desiccant. Furthermore, as for the desiccant, density of the corrosion inhibiter, before being diluted to insufficient level to prevention of corrosion, makes the surface of the wafer dry.