Apparatus and method for detecting a transition of the wafer surface structure for the control and the state understand the process in the chemical mechanical polishing

摘要

I will provide an apparatus and method for detecting a transition of the wafer surface structure for the control and state grasp of the process in [challenge] chemical mechanical polishing. SOLUTION: In the chemical mechanical polishing apparatus is provided with a cavity for the wafer carrier plate, to accept the sensor located in close proximity to the wafer to be polished. With only a very short distance, it is propagated to the sensor, it is sensed by the sensor, the energy generated by the contact between the wafer exposed surface and polishing pad, data about the nature and structure of the exposed surface of the wafer, and the transition of the structure I provide. Correlation method provides a graph associated with the transition surface structure energy sensed. Correlation graph provides a processing state data for the control.