In grinding manner of the chamfer aspect of the semiconductor wafer and the chamfer aspect

摘要

PROBLEM TO BE SOLVED: To provide a method and device for polishing the chamfering surface of a semiconductor wafer unlikely to generate micro-flaws on the chamfering surface after being ground and capable of maintaining the shape of the chamfered surface and enhancing its flatness. ;SOLUTION: Together with an abrasive material, an abrasive thread 12 is pressed relatively to the chamfering surface of a silicon wafer W, and from the chamfering surface, splinters and fragments of mono-crystalline silicon are satisfactorily torn off. The polish thread 12 has a smaller surface area than any conventional abrasive cloth. Even if the torn-off splinters, etc., attach to the abrasive thread 12, they are removed from the thread 12 simply and exhausted to outside the silicon wafer W. Accordingly it is not likely to generate micro-flaws on the chamfering surface after being ground. It is also possible to maintain the shape of the chamfered surface and enhance its flatness.;COPYRIGHT: (C)2000,JPO