首页> 外国专利> AUTOMATIC ELECTRONIC COMPONENT MOUNTING UNIT, ELECTRONIC COMPONENT FEEDING UNITS, ELECTRONIC COMPONENT SEQUENCER UNIT, AND ELECTRONIC COMPONENT MOUNTING METHOD

AUTOMATIC ELECTRONIC COMPONENT MOUNTING UNIT, ELECTRONIC COMPONENT FEEDING UNITS, ELECTRONIC COMPONENT SEQUENCER UNIT, AND ELECTRONIC COMPONENT MOUNTING METHOD

机译:自动电子组件安装单元,电子组件送纸单元,电子组件定序器单元以及电子组件安装方法

摘要

PPROBLEM TO BE SOLVED: To provide an automatic electronic component mounting unit, electronic component feeding units, an electronic component sequencer unit, and an electronic component mounting method, suitable for use in both batch production of various items and mass production of various items. PSOLUTION: The automatic electronic component mounting unit 1 for mounting an electronic component on a printed wiring board 10 comprises a component mounting head 4 that moves in the X-axis direction and adsorbs an electronic component for mounting the same on the printed wiring board 10, a table 8 that carries the printed wiring board 10 in the Y-axis direction, electronic component feeding units 12, 14 that are installed on the table 8 and move simultaneously with the printed wiring board 10, and a component image recognizing/correcting means 16 that recognizes the attitude of the electronic component from its image and corrects the attitude within the period from electronic component adsorption by the component mounting head 4 to the mounting of the same. The positions of electronic component adsorption and mounting by the component mounting head 4 and that of the electronic component image recognition are aligned on the X-axis. Further, an angular pipe model and a plate model are disclosed of the electronic component feeding unit. PCOPYRIGHT: (C)2005,JPO&NCIPI
机译:

要解决的问题:提供一种自动电子元件安装单元,电子元件馈送单元,电子元件定序器单元和电子元件安装方法,适用于各种项目的批量生产和各种批量生产项目。

解决方案:用于将电子部件安装在印刷线路板10上的自动电子部件安装单元1包括部件安装头4,该部件安装头4在X轴方向上移动并且吸附电子部件以将其安装在印刷线路上基板10,在Y轴方向上承载印刷线路板10的工作台8,安装在工作台8上并与印刷线路板10同时移动的电子元件进给单元12、14以及元件图像识别/校正装置16,该校正装置16从图像中识别出电子部件的姿态,并在从部件安装头4吸附电子部件到安装电子部件的期间内校正该姿态。通过元件安装头4进行的电子元件吸附和安装的位置以及电子元件图像识别的位置在X轴上对齐。此外,公开了电子部件进给单元的角管模型和板模型。

版权:(C)2005,JPO&NCIPI

著录项

  • 公开/公告号JP2004363546A

    专利类型

  • 公开/公告日2004-12-24

    原文格式PDF

  • 申请/专利权人 POPMAN CORP;

    申请/专利号JP20030370472

  • 发明设计人 SHIMADA KATSUMI;

    申请日2003-10-30

  • 分类号H05K13/04;H05K13/02;

  • 国家 JP

  • 入库时间 2022-08-21 22:29:13

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