首页>
外国专利>
The chemical mechanical grinding pad which possesses the micro hole
The chemical mechanical grinding pad which possesses the micro hole
展开▼
机译:具有微孔的化学机械研磨垫
展开▼
页面导航
摘要
著录项
相似文献
摘要
Disclosed is a chemical mechanical polishing pad formed at a polishing surface thereof with micro-holes each having a desired cross-sectional area while having a desired depth. The shape, size, and density of the micro-holes can be optionally adjusted. The chemical mechanical polishing pad provides an effect of maintaining a desired polishing rate during a polishing process. In accordance with the present invention, the micro-holes can have diverse arrangements depending on given process conditions.
展开▼