Underfill that is pre-applied at the package level in order to improve the thermomechanical reliability of the electronic component assembly

摘要

Surface mount package having on its underfill that is pre-coated (50) and (70), and methods of making and using such packages is provided. And also to improve mechanical reliability and thermal surface mount package, can be supplied to customers package having an underfill coated pre-application and curing of the underfill material cost of additional tools, and manpower I will reduce the need for customers of process-related tasks.