The reconstruction possible processor module which includes the integrated circuit die/di element where mixture was accumulated

摘要

Reconstruction possible processor module (60) the integrated circuit IC die/di element where mixture was accumulated is included. With execution example of the specification being disclosed here, making use of the contact which crosses the thickness of the die/di, to constitute one or the microprocessor where plural makes thin (64), memory (66) and/or field programmable gate array (FPGA) the die/di (68) the element the accumulation and by connecting mutually it is possible the processor module which has reconfigurability. Joint ownership of the data with the microprocessor and the FPGA element accelerates largely by the processor module which is disclosed, final assembly yield rate improves, is annexed and final assembly cost is decreased, it is profitable.