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The route appointment by the anti fuse of the die/di

机译:死区/死区的反熔丝的路径指定

摘要

The program possible route designated device is offered to the semiconductor die/di in order to allot to the connection point which signal route is selected, inside. The switching matrix which at least installs one anti fuse is utilized in order the route to appoint the signal route on the semiconductor die/di selectively. For example, in order or, for feature or control of the tip/chip possibility conversion or when it is converted impossibly, for the tip/chip to operate selective, at the time of plural various socket arranging, the tip/chip can be utilized separately in order to reconstruct the pin allotment of the tip/chip. The further choices in order with process and the piggy back style which program the first tip/chip, namely to put the other tip/chip on one tip/chip, include with the process which laminates the first tip/chip in the second tip/chip. The contact pin is connected electrically, the frame outside in order to form the tip/chip which it is laminated is converted with that, and necessity of the route designated mechanism of the pin are evaded. In order the pin where the tip/chip which is laminated at the time of tip/chip constituting which it is laminated is converted, is not utilized to line up, the control pin is appointed the route.
机译:在内部将编程可能的路径指定设备提供给半导体芯片/ di,以便分配给选择了信号路径的连接点。为了至少有选择地在半导体芯片/ di上指定信号路径,利用了至少安装一个防熔丝的开关矩阵。例如,为了使笔尖/切屑可能性转换的特征或控制或当不可能进行转换时,为了使笔尖/切屑选择性地工作,在布置多种插座时,可以利用笔尖/切屑。分别重建针尖/芯片的针脚分配。编程第一笔尖/切屑的过程和背负式顺序的进一步选择,即将另一个笔尖/切屑放在一个笔尖/切屑上,包括将第一笔尖/切屑层压在第二笔尖/切屑中的过程。芯片。接触销被电连接,为了形成其被层叠的尖端/芯片而将框架的外部转换为该销,从而避免了销的路径指定机构的需要。为了使在层叠时构成的尖端/芯片的层叠时的尖端/芯片的引脚不被转换,而将控制引脚指定为路径。

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