The porcelain constituent for high frequency, the porcelain and its production manner null for high frequency

摘要

PROBLEM TO BE SOLVED: To provide a porcelaneous composition, capable of being sintered at 800-1,000°C, having low permittivity, low dielectric loss and thermal expansion coefficient approximate to chip parts (e.g. GaAs) and printed boards, and useful for insulating layers of high-frequency wiring boards capable of reliably being mounted by the parts or the boards. ;SOLUTION: This porcelaneous composition is a mixture comprising (A) 50-95 wt.% glass powder capable of separating out spinel oxide crystalline phase containing SiO2, Al2O3, MgO, ZnO and B2O3, (B) 0-30 wt.% SiO2 and (C) 0.1-50 wt.% compound oxide between SrO and SiO2. The composition is molded and is sintered at 800-1,000°C to form porcelains containing (i) spinel oxide crystalline phase (SP) such as spinel, (ii) SiO2 crystalline phase (Si) such as; quartz and (iii) compound oxide crystalline phase (SL) (e.g. slawsonite) containing Sr, Al and Si and having ≥5.5 ppm/°C thermal expansion coefficient at the temperature between the room temperature and 400°C.;COPYRIGHT: (C)2000,JPO