Epoxy molding compositions with reduced moisture absorption

摘要

Encapsulant or molding compositions of the electronic element for there is no excessive swelling and methods for their preparation [challenge] moisture absorption is reduced. [SOLUTION] epoxy resin, curing agent and kneaded clay, allowed to cool, and then adding a catalyst, epoxy - Clay Nano - to prepare a composition, it is combined with a large amount of the resin.