Failure analysis method and failure analysis apparatus for a semiconductor wafer

摘要

PURPOSE: To obtain the method and device of defect analyzer of a semiconductor wafer having improved collating accuracy and estimated accuracy. ;CONSTITUTION: The data, containing the defect position coordinate based on the result of the physical inspection on the foreign substance, the defect, etc., on the surface of semiconductor wafers of a defect inspection device 3, is stored in a memory storage 10. The physical position coordinate data based on the bit fail data sent from a tester 6 is stored in a memory storage 13. The data shown by an additional defective region is formed by an additional defective region presuming means 14 based on the bit fail data, and it is stored in a memory storage 15. A correction physical position coordinate data, containing limited conditional data by defective mode stored in the physical position coordinate data stored in the memory storage 13, is formed by a collating means 16, and the above-mentioned correction physical position coordinate data and the defective position coordinate data stored in the memory storage 10 are collated with each other. Defects are analyzed on the result of the above- mentioned collation.;COPYRIGHT: (C)1996,JPO