In the single surface of the adhesion film for semiconductor wafer back grinding and the processed mannered null backing material film

摘要

PROBLEM TO BE SOLVED: To obtain the subject film having a tacky adhesive layer containing a specific amount of a cross-linking agent and a copolymer produced by the copolymerization of a mixture of specific amounts of monomers, giving little contamination on the surface of a semiconductor wafer and, if contaminated, removable with water. ;SOLUTION: This tacky adhesive film is produced by coating a single surface of a substrate film with a tacky adhesive containing (A) 100 pts.wt. of a tacky adhesive polymer produced by the copolymerization of 100 pts.wt. of a monomer mixture containing (i) 67-98.9 pts.wt. of a main monomer preferably consisting of at least one kind of alkyl (meth)acrylate, (ii) 1-30 pts.wt. of a commoner having a functional group (preferably hydroxyl group or amino group) reactive with a cross-linking agent mentioned below and (iii) 0.1-3 pts.wt. of at least one kind of water-soluble comonomer selected from sulfosuccinic acid diester salts of formula I (R₁ is an alkyl, an alkenyl, an alkylphenyl, etc.; R₂ is H or methyl; A is a 2-3C alkylene; (n) is an integer of 0-100; M is a univalent cation) and formula II and (B) 0.3-15 pts.wt. of a cross-linking agent.;COPYRIGHT: (C)1997,JPO