The method of determining the processing conditions, processing conditions determination system, processing system, processing condition determination computer program, program recording medium, and a method of manufacturing a semiconductor device

摘要

In step S11, respectively, are changed stepwise at a predetermined pitch amount varying the (parameter), to determine the standard processing conditions a combination thereof. For each of all the standard processing conditions, performs actual machining, and standard machining shape to the standard processing conditions, respectively, a machining shape obtained as a result (step S12). If there is a suitable simulation program, and without actual machining, it may be obtained by standard machining simulation shape. Standard machining shape and the standard machining conditions obtained in this manner is stored in the storage device. When the objective shape to be machined in the step S13 is given, in step S14, it is to explore the standard processing shape close to a purpose shape. In this way, when the machining shape is given, it is possible to determine the processing conditions corresponding thereto.