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Prediction method of the machining shape, the method of determining the processing conditions, processing method, processing system, a method of manufacturing a semiconductor device, a computer program, and a computer program storage medium
Prediction method of the machining shape, the method of determining the processing conditions, processing method, processing system, a method of manufacturing a semiconductor device, a computer program, and a computer program storage medium
PROBLEM TO BE SOLVED: To provide a machining condition determining method by which machining conditions for obtaining a prescribed machining shape can be determined accurately and easily in a machining system.;SOLUTION: The relation between polishing conditions to be a constituent and a machining shape (polishing quantity) obtained thereby is previously inputted in a polishing condition determining means, along with the kinds of polishing objects and polishing conditions (stable polishing conditions) which are used shared for polishing the polishing objects. The polishing condition determining means determines the polishing conditions on the basis of these conditions. That means, by providing the polishing conditions to be the constituent in time series or converting combinations of the polishing conditions to be the constituent into the change in the rotational speed of a polisher, the rotational speed according to a rotation position is determined. The polishing conditions, determined by the polishing condition determining means, are inputted into a polishing machine control means, and the polishing machine control means controls the polishing machine, so that the conditions are achieved.;COPYRIGHT: (C)2002,JPO
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