首页> 外国专利> Prediction method of the machining shape, the method of determining the processing conditions, processing method, processing system, a method of manufacturing a semiconductor device, a computer program, and a computer program storage medium

Prediction method of the machining shape, the method of determining the processing conditions, processing method, processing system, a method of manufacturing a semiconductor device, a computer program, and a computer program storage medium

机译:加工形状的预测方法,确定加工条件的方法,加工方法,加工系统,半导体装置的制造方法,计算机程序以及计算机程序存储介质

摘要

PROBLEM TO BE SOLVED: To provide a machining condition determining method by which machining conditions for obtaining a prescribed machining shape can be determined accurately and easily in a machining system.;SOLUTION: The relation between polishing conditions to be a constituent and a machining shape (polishing quantity) obtained thereby is previously inputted in a polishing condition determining means, along with the kinds of polishing objects and polishing conditions (stable polishing conditions) which are used shared for polishing the polishing objects. The polishing condition determining means determines the polishing conditions on the basis of these conditions. That means, by providing the polishing conditions to be the constituent in time series or converting combinations of the polishing conditions to be the constituent into the change in the rotational speed of a polisher, the rotational speed according to a rotation position is determined. The polishing conditions, determined by the polishing condition determining means, are inputted into a polishing machine control means, and the polishing machine control means controls the polishing machine, so that the conditions are achieved.;COPYRIGHT: (C)2002,JPO
机译:解决的问题:提供一种加工条件确定方法,通过该方法,可以在加工系统中准确,容易地确定用于获得规定加工形状的加工条件。解决方案:构成要件的抛光条件与加工形状之间的关系(将由此获得的抛光量,抛光对象的种类和抛光条件共同使用的抛光条件(稳定的抛光条件)预先输入到抛光条件确定装置中。抛光条件确定装置根据这些条件确定抛光条件。就是说,通过按时间顺序提供要构成的抛光条件或将要构成的抛光条件的组合转换为抛光机的转速变化,从而确定根据旋转位置的转速。由抛光条件确定装置确定的抛光条件被输入到抛光机控制装置中,并且抛光机控制装置控制抛光机,从而达到条件。版权所有:(C)2002,JPO

著录项

  • 公开/公告号JP5002875B2

    专利类型

  • 公开/公告日2012-08-15

    原文格式PDF

  • 申请/专利权人 株式会社ニコン;

    申请/专利号JP20010268610

  • 发明设计人 千賀 達也;上田 武彦;石川 彰;

    申请日2001-09-05

  • 分类号H01L21/304;B24B37/04;

  • 国家 JP

  • 入库时间 2022-08-21 17:40:30

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