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The scribe method of using the scribe device and that cutter wheel which use the cutter wheel and its cutter wheel for the non-metallic substance

机译:使用划片装置的划片方法以及使用该划片轮及其划片轮的非金属物质的划片轮

摘要

Cutter wheel 1, making through the spindle the axial hole pass 6, while convoluting on the surface of the brittle material, has had the regulation aspect 3 which regulates the invasion depth of edge 2 from the brittle material surface on both sides of edge 2. Until the regulation aspect contacts the surface of the non-metallic substance, pressurizing this cutter wheel, while maintaining a state where it makes the edge invade inside the non-metallic substance the non-metallic substance the scribe it does the scribe method of the non-metallic substance which uses this cutter wheel, by making the said cutter wheel specified direction convolute.
机译:沿主轴通过轴向孔道6的切刀轮1在脆性材料的表面上回旋时,具有调节方面3,其调节边缘2从边缘2的两侧上的脆性材料表面侵入边缘的深度。直到限制方面接触非金属物质的表面,对该切刀轮加压,同时保持其使边缘侵入非金属物质内部的状态,从而对非金属物质进行划刻。 -通过使所述切割轮的指定方向回旋而使用该切割轮的金属物质。

著录项

  • 公开/公告号JPWO2003057440A1

    专利类型

  • 公开/公告日2005-05-19

    原文格式PDF

  • 申请/专利权人 三星ダイヤモンド工業株式会社;

    申请/专利号JP20030557781

  • 发明设计人 若山 治雄;

    申请日2002-12-27

  • 分类号B28D5/00;B28D1/24;C03B33/10;

  • 国家 JP

  • 入库时间 2022-08-21 22:26:43

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