首页> 外国专利> Conductive elements with adjacent, mutually adhered regions and semiconductor device assemblies including such conductive elements

Conductive elements with adjacent, mutually adhered regions and semiconductor device assemblies including such conductive elements

机译:具有相邻的,相互粘附的区域的导电元件以及包括这种导电元件的半导体器件组件

摘要

Conductive elements that include a plurality of adjacent, mutually adhered regions are disclosed. All of the regions may include the same type of material. At least a portion of such a conductive element may be configured to extend laterally. In a semiconductor device assembly, such a conductive element is in electrical communication with a contact of at least one semiconductor device component, and may extend between corresponding contacts of two or more semiconductor device components.
机译:公开了包括多个相邻的,相互粘附的区域的导电元件。所有区域可以包括相同类型的材料。这种导电元件的至少一部分可以被配置为横向延伸。在半导体器件组件中,这种导电元件与至少一个半导体器件部件的触点电连通,并且可以在两个或更多个半导体器件部件的相应触点之间延伸。

著录项

  • 公开/公告号US2005230806A1

    专利类型

  • 公开/公告日2005-10-20

    原文格式PDF

  • 申请/专利权人 VERNON M. WILLIAMS;

    申请/专利号US20050140823

  • 发明设计人 VERNON M. WILLIAMS;

    申请日2005-05-31

  • 分类号H01L29/76;

  • 国家 US

  • 入库时间 2022-08-21 22:25:17

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号