Semiconductor chip, tape carrier package having the same mounted thereon, and liquid crystal display apparatus including the tape carrier package

摘要

A semiconductor chip, a TCP on which the semiconductor chip may be mounted, and/or an LCD apparatus which may include the TCP may be reduced in size by reducing the circuit patterns which may pass through the base film and bypass patterns which may be formed in wiring patterns within the chip. The size and/or manufacturing costs of the TCP and LCD apparatus may be reduced by changing circuit patterns which may pass through the base film.