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Package structure of optical sensitive device and method for packaging optical sensitive device

机译:光学敏感器件的包装结构及包装光学敏感器件的方法

摘要

The present invention provides a package structure of optical sensitive device. The package structure includes a silicon substrate, an optical sensitive device, a supporting pad, a transparent plate and a plurality of conductive wires. The optical sensitive device is positioned on the silicon substrate, and the transparent plate is fixedly positioned on the supporting pad and corresponds to the optical sensitive area of the optical sensitive device. The transparent plate can be positioned on the substrate, and the electrical wires are electrically connected between the optical sensitive device and the substrate. A molding material is applied the periphery of the optical sensitive device and the substrate to prevent the electrical wires from exposed and damaged, thereby resulting in virtually eliminating particle containment
机译:本发明提供了一种光敏器件的封装结构。封装结构包括硅基板,光敏器件,支撑垫,透明板和多条导线。感光器件位于硅基板上,透明板固定位于支撑垫上,并与感光器件的感光区域相对应。透明板可以位于基板上,并且电线在光敏器件和基板之间电连接。在光敏器件和基板的外围应用了模塑材料,以防止电线裸露和损坏,从而实际上消除了颗粒的包裹

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