首页> 外国专利> Plasma processing apparatus and system, performance validation system and inspection method therefor

Plasma processing apparatus and system, performance validation system and inspection method therefor

机译:等离子处理设备和系统,性能验证系统及其检查方法

摘要

A plasma processing apparatus including a plasma processing chamber having a plasma excitation electrode for exciting a plasma, a radiofrequency generator for supplying a radiofrequency voltage to the electrode, a radiofrequency feeder connected to the electrode, and a matching circuit having an input terminal and an output end. The input terminal is connected to the radiofrequency generator and the output end is connected to an end of the radiofrequency feeder so as to achieve impedance matching between the plasma processing chamber and the radiofrequency generator. A frequency which is three times a first series resonant frequency f0 of the plasma processing chamber, which is measured at the end of the radiofrequency feeder, is larger than a power frequency fe of the radiofrequency waves.
机译:一种等离子体处理设备,包括:等离子体处理室,其具有用于激发等离子体的等离子体激发电极;向发生器提供射频电压的射频发生器;连接至电极的射频馈线;以及具有输入端和输出端的匹配电路结束。输入端连接至射频发生器,输出端连接至射频馈线的一端,以实现等离子体处理腔室与射频发生器之间的阻抗匹配。在射频馈线末端测得的等离子体处理室的第一串联谐振频率f 0 的三倍的频率大于电源频率f e

著录项

  • 公开/公告号US2005061443A1

    专利类型

  • 公开/公告日2005-03-24

    原文格式PDF

  • 申请/专利权人 AKIRA NAKANO;TADAHIRO OHMI;

    申请/专利号US20040950045

  • 发明设计人 AKIRA NAKANO;TADAHIRO OHMI;

    申请日2004-09-24

  • 分类号C23F1/00;

  • 国家 US

  • 入库时间 2022-08-21 22:24:06

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号