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Material for vacuum device, vacuum device, vacuum apparatus, manufacturing method of material for vacuum device, processing method of vacuum device, and processing method of vacuum apparatus

机译:真空装置用材料,真空装置,真空装置,真空装置用材料的制造方法,真空装置的加工方法以及真空装置的加工方法

摘要

The present invention relates to a manufacturing method of a material for vacuum device used in a vacuum apparatus that generates ultra-high vacuum and performs processing. Its constitution has the steps of: reducing pressure around the alloy of Cu and a doping element; increasing the temperature of the alloy to outgas hydrogen from the alloy, and gathering the doping element near the surface of the alloy and precipitating the doping element; and exposing the alloy to single oxygen, single nitrogen, mixed gas of oxygen and nitrogen, ozone (O3), oxygen content compound, nitrogen content compound or oxygen-nitrogen content compound, or a combination of them, or a plasma thereof while the temperature of the alloy is maintained at a range of room temperature or higher and the temperature of the alloy increased for outgassing hydrogen or lower, whereby it is reacted with the precipitated doping element so that one of an oxide film, a nitride film and an oxide-nitride film of the doping element is formed on a surface layer of the alloy.
机译:真空装置用材料的制造方法技术领域本发明涉及在产生超高真空并进行处理的真空装置中使用的真空装置用材料的制造方法。其构成具有以下步骤:降低Cu和掺杂元素合金周围的压力;升高合金的温度以使合金中的氢气逸出,并使掺杂元素聚集在合金表面附近并沉淀出掺杂元素;使合金暴露于单一氧,单一氮,氧与氮的混合气体,臭氧(O 3 ),氧含量化合物,氮含量化合物或氧氮含量化合物或它们的组合当合金的温度保持在室温或更高的温度并且合金的温度升高以放出氢气或更低的温度时,其等离子体或其等离子与沉淀的掺杂元素反应,从而氧化膜之一然后,在合金的表面层上形成掺杂元素的氮化物膜和氮氧化物膜。

著录项

  • 公开/公告号US2004253448A1

    专利类型

  • 公开/公告日2004-12-16

    原文格式PDF

  • 申请/专利权人 VACLAB INC.;

    申请/专利号US20040862358

  • 发明设计人 FUMIO WATANABE;

    申请日2004-06-08

  • 分类号B32B15/04;C23C8/34;

  • 国家 US

  • 入库时间 2022-08-21 22:23:27

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