Apparatus for controlling galvanic corrosion effects on a single-wafer cleaning system

摘要

A single substrate cleaning apparatus that prevents galvanic corrosion is provided. The apparatus includes a spindle configured to rotatably support a substrate. A moveable dispense arm disposed over the spindle is included. The dispense arm supports a first supply line and a second supply line. The first supply line has a first nozzle affixed to an end of the first supply line, and the second supply line has a second nozzle affixed to an end of the second supply line. The first nozzle is positioned behind the second nozzle such that a fluid dispensed from the second nozzle is dried by application of a fluid simultaneously dispensed from the first nozzle in manner that protects the substrate from galvanic corrosion.