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Thermal physical vapor deposition source with minimized internal condensation effects

机译:具有最小内部凝结效应的热物理气相沉积源

摘要

A thermal physical vapor deposition source for depositing material onto a substrate includes an elongated container for receiving the material, the container having a conductance CB in the elongated direction, and a heater for heating the material in the container to vaporize the material to a partial pressure Pm. The container has at least one member defining a plurality of apertures arranged along the length of the member, the apertures having a total conductance CA, wherein <math overflow="scroll"><mrow><mrow><mfrac><msub><mi>C</mi><mi>A</mi></msub><msub><mi>C</mi><mi>B</mi></msub></mfrac><mo>≤</mo><mn>0.5</mn></mrow><mo>;</mo></mrow></math> and end heaters for heating each side of the container to reduce condensation of material onto the container.
机译:用于将材料沉积到基板上的热物理气相沉积源包括用于接收材料的细长容器,该容器在细长方向上具有电导C B 以及用于加热容器中材料的加热器使材料蒸发至分压P m 。所述容器具有至少一个构件,所述至少一个构件限定了沿所述构件的长度布置的多个孔,所述孔具有总电导C A ,其中 <![CDATA [<数学溢出=“ scroll”> C A C B 0.5 < / mn> ; ]]> 末端加热器用于加热容器的每一侧,以减少物料凝结在容器上。

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