Method of manufacturing mount structure without introducing degraded bonding strength of electronic parts due to segregation of low-strength/low-melting point alloy

摘要

A method of manufacturing a mount structure according to the present invention which forcedly cools down a melted solder paste on a printed circuit board at a cooling speed of 1.5° C./second or higher to solidify the solder paste when an electronic part is mounted on the printed circuit board by reflow processing.