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Silicon oxide layer reduced in dangling bonds through treatment with hypofluorous acid, process for growing silicon oxide layer and method for deactivating dangling bonds therein

机译:通过次氟酸处理减少了悬空键的氧化硅层,生长氧化硅层的方法和使悬空键失活的方法

摘要

Dangling bonds of silicon atoms tend to take place in silicon oxide grown on a silicon wafer due to oxygen deficiency; hypofluorous acid is introduced into the silicon oxide so that the hypofluorous acid reaches the dangling bonds through diffusion; the hypofluorous acid is decomposed into fluorine atoms and hydroxyl groups, and the fluorine atoms and hydroxyl groups deactivate the dangling bonds of silicon atoms; even if electric charges are injected into the silicon oxide, the deactivation is never broken so that the silicon oxide layer is stable and highly reliable.
机译:由于缺氧,硅原子的悬空键倾向于发生在硅晶片上生长的氧化硅中。将次氟酸引入到氧化硅中,使次氟酸通过扩散达到悬空键。次氟酸分解成氟原子和羟基,氟原子和羟基使硅原子的悬空键失活。即使将电荷注入到氧化硅中,也不会破坏钝化,因此氧化硅层​​是稳定且高度可靠的。

著录项

  • 公开/公告号US6896861B2

    专利类型

  • 公开/公告日2005-05-24

    原文格式PDF

  • 申请/专利权人 YOSHIYUKI MIYAMOTO;

    申请/专利号US20020192732

  • 发明设计人 YOSHIYUKI MIYAMOTO;

    申请日2002-07-11

  • 分类号H01L21/316;B32B9/04;

  • 国家 US

  • 入库时间 2022-08-21 22:21:16

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