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High-frequency circuit board unit, high frequency module using the same unit, electronic apparatus using the same module, and manufacturing method for the high-frequency circuit board unit
High-frequency circuit board unit, high frequency module using the same unit, electronic apparatus using the same module, and manufacturing method for the high-frequency circuit board unit
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机译:高频电路板单元,使用同一单元的高频模块,使用同一模块的电子设备以及高频电路板单元的制造方法
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摘要
A ground electrode and a terminal electrode are formed on a first main surface of dielectric substrate forming a circuit board. Wiring electrodes are formed on a second main surface of the dielectric substrate. A semiconductor device and a filter are mounted on the wiring electrodes. A strip line electrode of the filter is connected to the ground electrode of the circuit board for conducting direct current, via a through-hole provided in the filter, a ground electrode of the filter, the wiring electrode, and a through-hole provided in the circuit board. With this arrangement, the terminal electrode is connected to a high-frequency signal terminal of the semiconductor device via the filter.
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