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Semiconductor chip carrying adhesive tape/sheet, semiconductor chip carrier, semiconductor chip mounting method and semiconductor chip packaging body
Semiconductor chip carrying adhesive tape/sheet, semiconductor chip carrier, semiconductor chip mounting method and semiconductor chip packaging body
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机译:半导体芯片载带/片,半导体芯片载体,半导体芯片的安装方法及半导体芯片封装体
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摘要
A semiconductor chip carrying adhesive tape, wherein a plurality of adhesive agent portions for adhering semiconductor chips 2 are intermittently formed on a tape shaped base material 11 in the longitudinal direction of the base material 11 to have a substantially identical shape with that of the semiconductor chip 2 to be adhered or a slightly larger shape than that, and an adhesive agent constituting said adhesive agent portions 12 has gradable adhesiveness, can improve a yield of adhesive agent attached semiconductor chips 2 and prevent a wasteful use of an adhesive agent.
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