Assembly process and heat sink design for high powerd processor

摘要

The present invention includes one embodiment of a printed circuit board assembly including a printed circuit board, a microprocessor chip, a socket and an actuator for connecting the chip to the printed circuit board, a heat sink for attachment to the top surface of the chip, and a field installable thermal interface phase change pad positioned between the heat sink and the microprocessor chip. The heat sink has an actuator access opening so that the actuator is operable with the heat sink positioned on top of the microprocessor. The connection between the chip and the heat sink is free of alignment features so that they may be separated by twisting the heat sink relative to the chip. The connection between the heat sink and the circuit board is also free of alignment features.;One embodiment includes a method of disassembling and re-assembling a printed circuit board assembly including actuating an actuator of a socket attached to a printed circuit board with the socket securing a first chip to the printed circuit board and the first chip having a first thermal interface pad and a heat sink secured to the chip, removing the first chip and heat sink from the socket, separating the first chip from the heat sink, disposing the first chip and the first thermal interface pad, positioning a second chip on the socket, actuating the actuator to secure the second chip to the printed circuit board, positioning a second thermal interface pad on the top surface of the second chip, positioning the heat sink on the top surface of the second thermal interface pad, and securing the heat sink to the printed circuit board.