System and method for placing substrate contacts in a datapath stack in an integrated circuit design

摘要

A substrate contact placement system and method are provided for the placement of substrate contacts in a datapath stack in an integrated circuit design. In accordance with one aspect of the invention, a system establishes a floorplan for the datapath stack containing a plurality of datapath macros in a netlist, and determines a placement of substrate contacts for a datapath macro in the datapath stack to minimize area used for the substrate contacts. Then, the system adds substrate contacts to the datapath stack. In accordance with another aspect of the invention, a method includes establishing a floorplan for the datapath stack containing a plurality of datapath macros in a netlist, and determining a placement of substrate contacts for a datapath macro in the datapath stack to minimize area used for the substrate contacts. Then, the substrate contacts are added to the datapath stack.