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Polymer material having a low glass transition temperature for use in chemically amplified photoresists for semiconductor production

机译:玻璃化转变温度低的聚合物材料,用于半导体生产中的化学放大光致抗蚀剂

摘要

The invention relates to a polymer obtained by copolymerization of a first comonomer having a group catalytically cleavable by acid, a second comonomer having an anchor group for the subsequent linkage of an amplification agent, and a third comonomer having a carboxyl group being esterified with an alkyl group. It is also possible for one or more carbon atoms in the alkyl group to be replaced by oxygen. The polymer may also include fourth comonomers that include silicon-containing groups. By using the alkyl or alkoxyalkyleneoxy side groups introduced with the third comonomer, the glass transition temperature of the polymer can be reduced so that a photoresist containing the polymer provides a homogeneous polymer film on heating.
机译:本发明涉及通过使具有可被酸催化裂解的基团的第一共聚单体,具有用于随后的扩增剂连接的锚定基团的第二共聚单体和具有被烷基酯化的羧基的第三共聚单体共聚而获得的聚合物。组。烷基中的一个或多个碳原子也可能被氧取代。该聚合物还可以包括第四共聚单体,该第四共聚单体包括含硅基团。通过使用与第三共聚单体一起引入的烷基或烷氧基亚烷基氧基侧基,可以降低聚合物的玻璃化转变温度,从而使得包含聚合物的光致抗蚀剂在加热时提供均匀的聚合物膜。

著录项

  • 公开/公告号US6890699B2

    专利类型

  • 公开/公告日2005-05-10

    原文格式PDF

  • 申请/专利权人 KERSTIN SEIBOLD;OLIVER KIRCH;

    申请/专利号US20030377893

  • 发明设计人 OLIVER KIRCH;KERSTIN SEIBOLD;

    申请日2003-02-28

  • 分类号G03F7/004;

  • 国家 US

  • 入库时间 2022-08-21 22:19:04

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