首页> 外国专利> A METHOD OF MOLDING A THERMALLY CONDUCTIVE, AN ELECTRICALLY CONDUCTIVE AND STRUCTURALLY REINFORCED ARTICLE

A METHOD OF MOLDING A THERMALLY CONDUCTIVE, AN ELECTRICALLY CONDUCTIVE AND STRUCTURALLY REINFORCED ARTICLE

机译:一种模制导热,导电和结构增强制品的方法

摘要

A method of molding a reinforced article (100) for optimizing heat transfer, electrical conductivity and/or structural integrity is provided. A mold assembly is first provided which is capable of forming an article (100) of a desired configuration, which may include a base (112) and upstanding fins (114). The desired positioning of the filler within the molded article (100) is determined according to the thermal, electrical or structural needs of the article (100). An input gate (116) and output gate vent (118) is formed in the mold assembly to insure positioning of the filler as desired. Polymer, loaded with reinforced filler, is introduced into the mold assembly via the input gate (116). Polymer is positioned in the mold assembly with the reinforcing filler being substantially parallel and aligned with the flow path. A bottom surface (120) of base (112) is provided with flush thermal communication with a heat generating device which may be positioned in the area designated (122).
机译:提供一种模制增强制品(100)以优化传热,电导率和/或结构完整性的方法。首先提供一种模具组件,该模具组件能够形成所需构造的制品(100),该制品可以包括基部(112)和直立的翅片(114)。根据制品(100)的热,电或结构需要来确定填料在模塑制品(100)内的期望位置。输入浇口(116)和输出浇口(118)形成在模具组件中,以确保根据需要定位填充物。装有增强填料的聚合物通过输入浇口(116)引入模具组件中。将聚合物放置在模具组件中,其中增强填料基本平行并与流路对齐。基座(112)的底表面(120)与发热装置齐平热连通,该发热装置可以位于指定的区域(122)中。

著录项

  • 公开/公告号IN2002CN01795A

    专利类型

  • 公开/公告日2005-02-11

    原文格式PDF

  • 申请/专利权人

    申请/专利号INPCT/2002/1795/CHE

  • 发明设计人

    申请日2002-10-31

  • 分类号B29C33/10;

  • 国家 IN

  • 入库时间 2022-08-21 22:17:39

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