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CEMENTING COMPOSITIONS AND APPLICATIONS OF SUCH COMPOSITIONS TO CEMENTING OIL (OR SIMILAR) WELLS.

机译:固井组合物和这种组合物在固井(或类似井)中的应用。

摘要

CERAMIC SEMICONDUCTOR PACKAGES WHICH COMPRISE A LEAD FRAME (1) HAVING REGISTERING HOLES (4,5) AND A CERAMIC SUBSTRATE (2) HAVING A THERMALLY FUSIBLE BONDING MATERIAL SUCH AS A RESIN OR GLASS APPLIED TO THE SEALING SURFACE (6) OF THE SUBSTRATE ARE MANUFACTURED BY POSITIONING THE LEAD FRAME, USING A TRANSFER DEVICE (14), ON A LEAD FRAME-SUPPORTING PLATE (11) HAVING HOLES (20,21), THROUGH WHICH POSITIONING PINS (22) FORMED ON A POSITIONING BASE (12) ARE MADE TO PROTRUDE BY LIFTING THE BASE (12) BY A DRIVING MECHANISM (13), IN SUCH A MANNER THAT THE POSITIONING PINS PASS THROUGH THE REGISTERING HOLES (4,5) OF THE LEAD FRAME. THE SUBSTRATE IS THEN CENTERED AND POSITIONED ON THE LEAD FRAME USING A TRANSFER DEVICE (15) HAVING CHUCK HANDS (33). THEREAFTER, THE BONDING MATERIAL IS FUSED BY HEATING IN A HEATING FURNACE (16) TO BOND THE LEAD FRAME AND THE SUBSTRATE. FIGURE 7
机译:包含铅框架(1),具有注册孔(4,5)和陶瓷基质(2)的热熔陶瓷材料,例如贴在密封表面上的树脂或玻璃的热粘合材料(6)通过使用传输设备(14)将铅框架定位在铅支撑框架(11)上的孔(20,21)上,并通过在定位基座(12)上制成的定位销(22)进行制造通过驱动机构(13)提起基座(12)来进行生产,以使定位销穿过铅框架的重新安装孔(4,5)。然后使用具有卡盘手柄(33)的传输设备(15)将基质放置在铅框架上并定位在铅框架上。然后,通过在加热炉(16)中加热来熔合粘结材料,以粘结铅框架和基体。图7

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