VAPOR PHASE EPITAXIAL APPARATUS AND VAPOR PHASE EPITAXIAL METHOD

摘要

A vapor phase epitaxial apparatus comprises a sealable reaction furnace, a wafer accommodation body which is installed in the reaction furnace to dispose a wafer at a predetermined position, a gas feeding means for feeding raw gas toward the wafer, and a heating means for heating the wafer. An epitaxial film is formed on a surface of the wafer by feeding the raw gas into the reaction furnace in a high-temperature state while heating the wafer via the wafer accommodation body by the heating means in the reaction furnace. The wafer accommodation body comprises a heat flow control unit having a cavity formed for accommodating the wafer, and a heat flow transmission unit which is joined to the heat flow control unit to transfer the heat to the wafer accommodated in the cavity. The contact thermal resistance of the heat flow control unit with the heat flow transfer unit is set to be not lower than 1.0 x 10-6 m2K/W and not greater than 5.0 x 10-3 m2K/W, and the heat flow control unit is formed of a material having the thermal conductivity of not smaller than 0.5 times and not greater than 5 times of the thermal conductivity of the wafer disposed on the heat flow transfer unit.