METHOD OF REMOVING DEPOSIT FROM SUBSTRATE AND METHOD OF DRYING SUBSTRATE, AND DEVICE FOR REMOVING DEPOSIT FROM SUBSTRATE AND DEVICE OF DRYING SUBSTRATE USING THESE METHODS

摘要

A method of removing deposit adhered to the principal planes of a substrate (90) from the principal planes of the substrate by using air knife units having, therein, slit parts capable of discharging a fluid in a band shape. In the method, fluid lead-in passages (50) having a generally uniform shape in a direction orthogonal to the moving direction of the air knife units are formed between the air knife units and the principal planes of the substrate while moving the plurality of air knife units relative to the substrate, and the fluid is discharged from the slit parts formed at the rear parts of the air knife units toward the fluid lead-in passages. Next, the fluid is led onto wall surfaces or virtual wall surfaces formed oppositely to the front parts of the air knife units through the fluid lead-in passages, and further led out through the fluid lead-out passages (60) having a flow passage cross section larger than that of the fluid lead-in passages and formed between the air knife units and the wall surfaces so that the deposit adhered to the substrate is apart from the principal planes of the substrate together with the fluid.