A liquid delivery system for an electroplating apparatus, an electroplating apparatus with such a liquid delivery system, and a method of operating an electroplating apparatus

摘要

A liquid delivery system for an electroplating apparatus is disclosed as including a number of nozzles which are fixedly spaced apart from each other for delivering a liquid electrolyte into the apparatus, and each of the nozzle is adapted to deliver the electrolyte into the apparatus generally along a respective path, and the nozzles are movable on a plane substantially perpendicular to the path. There is also disclosed a current distributor for controlling the electric current density directed towards different parts of a substrate, e.g. PCB, to be plated. A system for delivering an electrolyte into a container of an electroplating apparatus is also disclosed as including a pipe for receiving the electrolyte from a liquid source, a number of outlets for receiving the electrolyte from the pipe and via which the electrolyte from the pipe is deliverable into the container, and means allowing, during operation, the electrolyte in the container to enter the outlet otherwise than from the pipe. A method of operating an electroplating apparatus is also disclosed as including the steps of (a) operating the electroplating apparatus at a first lower current density for a first period of time; and (b) operating the electroplating apparatus at a higher second current density for a second period of time.