Material for a heat dissipation substrate for mounting a semiconductor and a ceramic package using the same

摘要

A material for a semiconductor-mounting heat dissipation substrate comprises a copper-molybdenum rolled composite obtained by impregnating melted copper into a void between powder particles of molybdenum powder compact to obtain a composite of molybdenum and copper and then rolling the composite. The material for a semiconductor-mounting heat dissipation substrate is superior in thermal conductivity to a CMC clad material and easy in machining by a punch press. The substrate material is used in a heat dissipations substrate (13) of a ceramic package (11).