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Process for preparing a silicon dioxide layer by high temperature oxidation of a substrate having at least a germanium surface or a silicon-germanium surface

机译:通过对至少具有锗表面或硅锗表面的基板进行高温氧化来制备二氧化硅层的方法

摘要

The procedure for preparing a layer of silicon dioxide by high-temperature oxidation of a substrate with a formula of Si1-xGex, in which x is greater than 0 and less than or equal to 1, consists of the following stages: a) depositing on the substrate surface (12) a supplementary layer (13) of thickness hy and with a general formula of Si1-yGey, where y is greater than 0 and less than x; b) oxidising the supplementary layer at high temperature, typically above 400 degrees C, so that it is transformed wholly or partly into a layer of silicon dioxide (SiO2).
机译:通过对具有大于等于0且小于等于1的x的Si 1 -xGex的分子式进行高温氧化来制备二氧化硅层的步骤包括以下步骤:a)沉积在硅上。衬底表面(12)为厚度为hy的辅助层(13),其通式为Si1-yGey,其中y大于0且小于x。 b)在通常高于400摄氏度的高温下氧化补充层,使其完全或部分转化为二氧化硅(SiO2)层。

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