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Process for preparing a silicon dioxide layer by high temperature oxidation of a substrate having at least a germanium surface or a silicon-germanium surface
Process for preparing a silicon dioxide layer by high temperature oxidation of a substrate having at least a germanium surface or a silicon-germanium surface
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机译:通过对至少具有锗表面或硅锗表面的基板进行高温氧化来制备二氧化硅层的方法
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摘要
The procedure for preparing a layer of silicon dioxide by high-temperature oxidation of a substrate with a formula of Si1-xGex, in which x is greater than 0 and less than or equal to 1, consists of the following stages: a) depositing on the substrate surface (12) a supplementary layer (13) of thickness hy and with a general formula of Si1-yGey, where y is greater than 0 and less than x; b) oxidising the supplementary layer at high temperature, typically above 400 degrees C, so that it is transformed wholly or partly into a layer of silicon dioxide (SiO2).
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